Mobile Computers

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ScanPal EDA60K

  • Dual Data Entry
  • Rugged
  • Dimensions 8.48 x 3.09 x 1.1 in
  • Operating System Android 7.1
  • Processor Qualcomm 8917 1.4 GHz quad-core
  • Housing Grade Standard
  • Display resolution 480 x 800

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CN80G 

  • Future-Proof
  • Iron-Clad Security
  • Ultra-Rugged
  • Operating System Android 8
  • Memory 32 GB Flash/4 GB RAM
  • Processor 2.2 GHz Qualcomm Snapdragon 660 octa-core
  • Housing Grade Standard

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CN75

  • Housing Grade Standard
  • Compact
  • Rugged
  • Operating System Windows Embedded Handheld 6.5
  • Android 6.0 Marshmallow
  • Processor Texas Instruments 1.5 GHz OMAP 4470 dual-core
  • Display Resolution 480 x 640

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CN51

  • Housing Grade Standard
  • Voice Ready
  • Rugged
  • OS Versatility
  • Operating System Android 6.0 Marshmallow
  • Processor Texas Instruments 1.5 GHz OMAP 4470 dual-core
  • Dimension 6.45 x 2.93 x 1.26 in

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ScanPal EDA51

  • Rugged
  • Housing Grade Standard
  • Overall Dimensions 6.18 x 3.08 x 0.67 in
  • Operating System Android 8
  • Memory 16 GB Flash/2 GB RAM
  • Processor Qualcomm Snapdragon SDM450, 1.8 GHz octa-core
  • Drop Specifications Multiple 1.2 m (4 ft) drops to concrete at room temperature

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CT60 XP

  • 13-megapixel color camera
  • Dimension 6.3 in x 3.3 in x 0.8 in
  • V5.0 Bluetooth and BLE Supported
  • Memory 4 GB DDR4 RAM, 32 GB Flash
  • Processor 2.2 GHz Qualcomm SnapdragonNEWLINE660 octa-core
  • Display resolution 1280 x 720
  • Battery Type Li-Ion, 3.6 V, 4040 mAh

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CT40

  • Future-Proof
  • Ergonomic
  • Mobility Edge Platform
  • Camera Position Rear only
  • Durability Rugged 1.2 m (4 ft)
  • Operating System Android
  • 2.2 GHz Qualcomm Snapdragon 660 octa-core

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CT40 XP

  • 13-megapixel color camera
  • 8-megapixel front-facing camera
  • 6.4 in x 3.0 in x 0.7 in
  • Android version (guaranteed from 9.1 to at least 11/R)
  • 4 GB DDR4x RAM, 32 GB Flash
  • 2.2 GHz Qualcomm® Snapdragon™ 660 octa-core
  • One-year factory warranty

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EDA61K

  • 13.0-megapixel color camera with autofocus and LED flash
  • 206 mm x 78 mm x 41.9 mm
  • Integrated GPS
  • Android 9, upgradable to Android 10
  • 3 GB RAM, 32 GB Flash
  • Multiple 1.5 m (5 ft) drops to concrete at room temperature
  • One-year factory warranty

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EDA52

  • Rear: 13 – megapixel color camera
  • Front: 5-megapixed color camera
  • 159mm x 75 mm x 14.4 mm (6.26 in x 2.95 in x 0.57 in)
  • Honeywell S0703 Slim Imager (1D/2D barcode symbologies)
  • WLAN Supported EAP: TLS, PEAP, TTLS, PWD, LEAP
  • Android 11, and upgradeable to Android 13
  • Storage Expansion: MicroSD (up to 128 GB)

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CT45 / CT45 XP

  • 850, 900, 1800, 1900 (Quad Bands)
  • Retail, transportation & logistics, manufacturing, healthcare, and public service
  • 13-megapixel rear camera
  • 8-megapixel front-facing camera
  • One-year factory warranty
  • V5.1 Bluetooth and BLE
  • Honeywell FlexRange, Honeywell S0703 (1D/2D barcode symbologies), Honeywell SDKs for Android

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CT30 XP

  • Processor Qualcomm QCS4290/QCM4290 octa-core, 2.0GHz
  • Compatible with Universal Dock
  • Disinfectant Ready Housing
  • Android
  • 13-megapixel rear camera
  • 8-megapixel front camera
  • Mobility Edge

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CT30 XP HC

  • Compatible with Universal Dock
  • 8-megapixel front camera
  • 13-megapixel rear camera
  • Processor Qualcomm QCS4290/QCM4290 octa-core, 2.0GHz
  • Disinfectant Ready Housing
  • Android
  • Full Touch Screen Device

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CK65

  • Long-Life Smart Battery
  • Ultra-Rugged
  • Android 10 upgradable to Android 14*
  • 32 GB Flash/4 GB RAM
  • 2.2 GHz Qualcomm 64-bit Snapdragon octa-core
  • 3000 1.0 m (3.3 ft) tumbles
  • 3 m (10 ft) to concrete at room temperature, 2.4 m (8 ft) across operating range

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Dolphin CN80

  • Future-Proof
  • Rugged
  • Operating System Android 8
  • Memory 32 GB Flash/4 GB RAM
  • Processor 2.2 GHz Qualcomm Snapdragon 660 octa-core
  • Platform Mobility Edge
  • Durability Ultra-Rugged 2.4 m (8 ft)

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Dolphin CT60

  • Housing Grade Standard
  • Rugged
  • Future-Proof
  • Dimensions 6.3 x 3.2 x 0.75 in
  • Memory 32 GB Flash/4 GB RAM
  • Processor 2.2 GHz Qualcomm Snapdragon 660 octa-core
  • Mobility Edge Platform

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DS5 UHF RFID

  • Leverage your digital enterprise with DS5 UHF handheld ensuring more performance, range, and frequencies
  • WEH 6.5
  • Android
  • RFID (UHF) / EU (805-868Mhz) / U.S (902-928Mhz)

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DS5A

  • Powerful performance, large capacity battery and comfortable grip
  • Android 9.0/ Android 10
  • 1.8m Drop
  • 4.3 inch Display
  • Battery Capacity 5,800 mAh
  • IP67
  • RFID

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DS5 | DS5W

  • Purpose-built design to meet unique needs of industrial mobility
  • CE 6.0 WEH 6.5
  • IP65
  • 3.5 / 4.3 inch Display
  • 1.8m Drop
  • Battery Capacity 5,800mAh
  • RFID

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DS4A

  • Android PDA that provides convenienct data input and the best work performance based on ergonomic design
  • Android 9
  • Compact Design
  • 4 inch Display
  • 1.8m Drop
  • Large Battery Capacity
  • IP65

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DS4

  • Compact design industrial PDA to handle any enterprise field mobility need
  • WEH 6.5 CE 6.0
  • Compact Design
  • 3.5 inch Display
  • 1.8m Drop
  • Large Battery Capacity
  • IP65

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DS70

  • Built to work any time, any place
  • Android 11
  • 2.0GHz Quad-core
  • 5.5″ HD+ IPS Display
  • 4,000/6,000mAh Large capacity Battery
  • LTE advanced Support
  • IP67 1.5m drop

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DS9

  • Embracing powerful Android features in dynamic enterprise mobility demands
  • Android 6.0 Marshmallow
  • Gloved-Touch Friendly
  • 5.5” HD IPS Display
  • Bluetooth Smart Ready
  • IP 67
  • 1.8m Drop

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DS10

  • Robust in any environment with the long-lasting battery
  • Android 9.0
  • 8 inch Display
  • Bluetooth 4.1 Smart Ready
  • LTE Advanced
  • 2.0 GHz Octa-core
  • 802. 11 a/b/g/n/ac
  • 8,500mAh Battery
  • IP67 1.5m Drop

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DS6

  • Specifically designed with Enterprise mobility in mind
  • Android 9, Android 10, (GMS)
  • 2.0 GHz Octa-core
  • 5” HD IPS Display
  • Corning Gorilla Glass 3
  • Bluetooth 4.2 Smart Ready
  • 802. 11 a/b/g/n/ac
  • LTE Advanced
  • IP67 1.5m Drop

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EC30

  • DIMENSIONS 4.5 in. W x 2.2 in. H x 0.55 in. D114 mm W x 57 mm H x 14 mm D
  • OPERATING SYSTEM Android 11; upgradeable to Android 12
  • DROP SPEC 4 ft./1.2 m drops to smooth concrete across operating temperature
  • WEIGHT 3.88 oz./110 g
  • CPU Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz
  • TUMBLE SPEC 1,000 1.6 ft./0.5 m tumbles

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PS20

  • DIMENSIONS 2.95 in. H x 8.58 in. L x 3.09 in. W7.50 cm H x 1.80cm L x 7.86 cm W
  • OPERATING SYSTEM Android 11; upgradeable to Android 13
  • DROP SPEC Multiple 4 ft./1.2 m drops to concrete over the entire operating temperature range
  • WEIGHT 290g
  • CPU Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz
  • TUMBLE SPEC 1,000 1.64 ft./0.5 m tumbles at room temperature

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TC8300

  • DIMENSIONS 9.17 in. L x 2.99 in. W x 2.52 in. D233 mm L x 76 mm W x 64 mm D
  • OPERATING SYSTEM Android 11; upgradeable to Android 14
  • DROP SPEC Multiple 8 ft./2.4 m drop to concrete at room temperature per MIL-STD 810G, multiple 6 ft./1.8 m drop to concrete across full operating temperature range
  • IP SEALING IP65
  • WEIGHTStandard: 17.2 oz./490 g
  • Package 1: 17.6 oz./500 g
  • CPU Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz
  • TUMBLE SPEC 2,000 3.28 ft./1 m tumbles

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MC9300

  • DIMENSIONS 9.4 in. L x 3.5 in. W x 7.4 in. H240 mm L x 88 mm W x 189 mm H
  • OPERATING SYSTEM Android 11; upgradeable to Android 14
  • DROP SPEC standards:10 ft. (3.1m) drops at room temperature per MIL-STD-810G8 ft. (2.4m) drops to concrete across temperature per MIL-STD-810G
  • Freezer:7 ft. (2.1m) drops to concrete across temperature per MIL-STD-810G
  • WEIGHT 26.9 oz/765g with battery
  • CPU Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz
  • TUMBLE SPEC 6,000 3.3 ft. (1m) tumbles; meets and exceeds IEC tumble specification

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TC21 and TC26

  • DIMENSIONS With standard battery: 6.22 in. L x 3.11 in. Wx.0.54 in. D (158 mm L x 79 mm W x 13.7 mm D)
  • With extended battery: 6.22 in. L x 3.11 in. W x.0.68 in. D (158 mm L x 79 mm W x 17.3 mm D)
  • DROP SPEC 4 ft./1.2 m (5ft with boot) drops to concrete per MIL-STD 810G across operating temperature
  • CPU Qualcomm Snapdragon™ 660 octa-core, 1.8 GHz or 2.2 GHz
  • SEALING IP67
  • OPERATING SYSTEM Android 11; upgradeable to Android 14
  • WEIGHT 8.32 oz./236 g with standard battery
  • TUMBLE SPEC 300 tumbles, 1.6 ft./0.5 m

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MC2200 and MC2700

  • DIMENSIONS 7.89 in. L x 2.76 in. W x 1.52 in. D200.5 mm L x 70 mm W x 38.5 mm D
  • OPERATING SYSTEM Android 11; upgradeable to Android 14
  • DROP SPEC Multiple 5 ft./1.52m drop to concrete across operating temperature per MIL-STD 810G
  • SEALING IP65
  • WEIGHT Standard Battery: 10.4 oz./296 gExtended Battery: 11.2 oz./316 g
  • CPU Qualcomm Snapdragon™ 660 octa-core, 1.8 GHz
  • TUMBLE SPEC 500 1.6 ft./0.5 m tumbles; meets and exceeds IEC tumble specifications

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EC50 and EC55

  • DIMENSIONS 6.08 in. L x 2.99 in. W x 0.377 in. D154.5 mm L x 76 mm W x 9.8 mm D 
  • With extended battery 6.08 in. L x 2.99 in. W x 0.46 in. D154.5 mm L x 76 mm W x 11.8 mm D
  • OPERATING SYSTEM Android 11; upgradeable to Android 14
  • DROP SPEC 4 ft./1.2 m per MIL-STD-810G.With protective boot: 5 ft./1.5 m per MIL-STD-810G to concrete across temperature range
  • WEIGHT 6.1 oz./173 g to 6.46 oz./183 g (SKU dependent with standard battery)
  • CPU Qualcomm SD660, 2.2 GHz Octa-core
  • TUMBLE SPEC 300 tumbles, 1.6 ft./0.5 m; 500 tumbles, 1.6 ft./0.5 m with protective boot

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MC33xx

  • DIMENSIONS Straight Shooter: 7.96 in. L x 2.94 in. W x 1.35 in. D (202.2 mm L x 74.7 mm W x 34.5 mm D)
    Gun/Pistol: 7.96 in. L x 2.94 in. W x 6.45 in. D (202.6 mm L x 74.7 mm W x 163.9 mm D)
  • OPERATING SYSTEM Android 11; upgradeable to Android 14
  • TUMBLE SPEC 3,000 3.3 ft./1 m tumbles
  • SEALING IP64
  • WEIGHT Straight Shooter: 16.7 oz./474 g
    Gun/Pistol: 18.8 oz./535 g
  • CPU Qualcomm Snapdragon™660 octa-core 2.2 GHz
  • DROP SPECMultiple 6 ft./1.8 m drops to concrete over the entire operating temperature range

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TC7X

  • DIMENSIONS 6.96 in. L x 3.38 in. W x 1.12 in. H (176.8 mm L x 85.8 mm W x 28.4 mm H);Grip area: 3.179 in. W x 0.80 in. H (80.75 mm W x 20.3 mm H)
  • OPERATING SYSTEM Upgradeable to Android 16
  • DROP SPEC Multiple 10 ft./3.05 m drops to concrete at room temp per MIL-STD 810H; multiple 8 ft./2.4 m drops to concrete over operating temp -20° C to 50° C per MIL-STD 810H
  • WEIGHT 12.3 oz./349 g with standard battery
  • CPU Qualcomm 6490 octa-core, 2.7 G
  • TUMBLE SPEC 2,000 3.3 ft./1.0 m tumbles; meets and exceeds IEC tumble specifications

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TC5X

  • DIMENSIONS 6.48 in. L x 3.04 in. W x 0.66 in. H (164.8 mm L x 77.35 mm W x 16.75 mm H)
  • OPERATING SYSTEM Upgradeable to Android 16
  • DROP SPEC Multiple 6 ft./1.8 m drops to concrete over operating temp (-20°C to 50°C / -4°F to 122°F) with protective boot per MIL STD 810H; Multiple 5 ft./1.5 m drops to tile over concrete (-10°C to 50°C / 14°F to 122°F) per MIL STD 810 H
  • IP SEALING IP68 and IP65 with battery per applicable IEC sealing specifications
  • WEIGHT 10.3 oz./293 g with standard battery
  • CPU Qualcomm 6490 octa-core, 2.7 GHz
  • TUMBLE SPEC 1000 1.6 ft./0.5 m tumbles at room termperature without protective boot; 1000 3.2 ft./1.0 m tumbles at room termperature with protective boot; meets or exceeds IEC tumble specification

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TC15

  • DIMENSIONS 6 .92 in. L x 3.09 in. H x 0.56 in. D175.8 mm L x 8.6 mm W x 14.2 mm D
  • POWER Removable, rechargeable Li-Ion battery, 5,000 mAh; 19.35Wh
  • DROP SPECS 4 ft./1.2 m drop to concrete per MIL-STD 810G across operating temperature
  • 5 ft./ 1.5 m drop to concrete per MIL-STD 810G across operating temperature with rugged boot.
  • CPU Qualcomm Snapdragon™ SM6375 Octa- (8) Core 2.2 GHz (2) & 1.8 GHz (6)
  • DISPLAY 6.5 inch/16.51 cm HD+, 720 x 1600, 450 NITS
  • OPERATING SYSTEM Android 11 with built-in support for a future Android release
  • IP SEALING IP65 and IP67